Phase mask for projection lithography and method for the manufacture thereof

ABSTRACT

A carrier of light-transmissive material has a mask pattern of light-absorbent material arranged thereon. The carrier comprises first regions and second regions that are not covered by the absorbent material. An optical thickness of the carrier in the first regions differs from an optical thickness in the second regions such that a phase difference of 180°±60° exists between light that has traversed the first regions and light that has traversed the second regions. For manufacturing the phase mask, the first regions are produced by isotropic etching of the light-absorbent material and the second regions are produced by anisotropic etching into the carrier.

This is a division of application Ser. No. 07/667,264, filed Mar. 11,1991, now U.S. Pat. No. 5,284,724.

BACKGROUND OF THE INVENTION

The invention is directed to a phase mask for projection lithographywith light having a wavelength λ for use in an exposure means having animaging scale m and having a numerical aperture NA. The invention isalso directed to a manufacturing method for such a phase mask.

Higher and higher packing densities are desired in the development ofsemiconductor modules. This requires a greater and greater reduction inthe minimal dimensions of the individual elements. Structural finenessesof less than 1 μm have already been achieved with the assistance ofmodern semiconductor technologies.

Constantly increasing demands made of the structuring technique areinvolved with the constant reduction in the minimum dimensions of theindividual elements. In particular, the resolution of the exposure meansutilized for the photolithography must be further improved in order topermit structuring that is dimensionally true.

The resolution is limited by diffraction effects at structural edges ofa projection mask employed in the exposure means. When the light passesthrough the projection mask, a part of the passing luminesceintensity--as a result of diffraction effects--proceeds into regionsthat are covered by the projection mask.

Employing what is referred to as a phase-shifting mask or phase mask forthe reduction of diffraction effects is known from M. D. Levenson etal., IEEE ED-29 (1982), page 1828. A phase mask is a projection maskwherein light that has passed through neighboring openings of theprojection mask is shifted in phase. In this known phase mask, the phaseshift amounts to 180°. A destructive interference between the twoopenings thereby arises, given exposure with coherent or partiallycoherent light. What this affects is that the intensity between the twoopenings is minimized. A phase mask is realized in that an opening inthe projection mask is provided with a light-transmissive layer havingthe thickness d=λ/(2 (n-1)), where n is the refractive index of thelight-transmissive layer, and λ is the wavelength of the light.

In the manufacture of the phase mask, a layer of electron beam lacqueris applied onto a carrier that is provided with a mask pattern oflight-absorbent material. This electron beam lacquer is structured inthe above-described way with the assistance of electron beamlithography. An alternative is to apply a layer of SiO_(x) or MgF₂ ontothe finished mask pattern, this layer being structured with theassistance of electron beam lithography and subsequent dry-etching.

T. Terasawa et al., Proc. SPIE 1088 (1989), page 25 discloses a phasemask wherein electron beam lacquer is likewise employed in order toproduce phase-shifting regions on the mask.

I. Hanyu et al., Abstract SPIE 1264 (1990) discloses a phase maskwherein the phase-shifting regions are composed of SiO₂. Formanufacture, an electron beam lacquer structure is produced on thefinished mask with the assistance of electron beam lithography. A SiO₂layer is applied onto this electron beam lacquer structure. The regionsof the SiO₂ having electron beam lacquer lying under them are removedwith a lift-off process.

M. Nakase et al., Preprint IEDM (1989) discloses a phase mask whereinthe phase-shifting regions are composed of electron beam lacquer. Thephase-shifting regions are arranged in self-aligned fashion on thelight-absorbing mask pattern. The electron beam lacquer projects beyondthe light-absorbing regions on the mask at the respective edges thereof.As a result thereof, the light-transmissive regions each receive arespective border that shifts the light phase by 180°. The work byProuty et al., Proc. SPIE 470 (1984), page 228 discloses that areduction of the diffration effects can already be achieved with phasemasks that effect a phase difference of 180°±60°.

What the methods for manufacturing phase masks of Levenson et al.,Terasawa et al. and Hanyu et al. have in common is that they eachrequire two electron beam lithography processes. This makes complicatedequipment necessary for producing the masks. The method of Nakase et al.has the disadvantage that it employs masks having phase-shifting regionsof electron beam lacquer. Such masks are difficult or impossible toclean. Moreover, the lacquer absorbs in the deep UV and, over and abovethis, has a refractive index differing from that of the mask carrier,this leading to multiple interferences.

SUMMARY OF THE INVENTION

An object of the invention is to specify a phase mask that can bemanufactured without additional electron beam lithography, and which iseasy to clean. Furthermore, it is also an object to specify amanufacturing method for such a mask.

For projection photolithography with light having a wavelength λ for usein an exposure means having an imaging scale m and a numerical apertureNA, this object is achieved according to the invention by a phase maskhaving the following features:

a) a carrier of light-transmissive material having a mask pattern oflight-absorbent material arranged thereon is provided;

b) outside of the mask pattern, the carrier has first regions and secondregions which are not covered by the absorbent material; and

c) given exposure in a medium having the refractive index n₁, theoptical thickness of the carrier in the second regions is lower by d=λ(1±1/3)/(2(n₂ -n₁)) than in the first regions, where n₂ is the refractiveindex in the first regions.

The different optical thickness of the carrier in the first regions andin the second regions causes a phase shift of the light which has passedthrough the first regions relative to light which has passed through thesecond regions. The phase shift thus lies in the range 180°±60°. It iscritical for the invention that the phase-shifting regions are realizedin the carrier of the phase mask itself.

The suppression of diffraction effects is optimum, given a phase shiftof 180°.

It lies within the framework of the invention that the carrier iscomposed, for example, of quartz through and through. In this case, thelight transmissivity is the same in the first regions and in the secondregions.

In another embodiment, the carrier is composed of a substrate formed ofa light transmissive, first material whose surface is exposed in thesecond regions. Structures composed of a light-transmissive, secondmaterial are arranged on the substrate, the surface of this secondmaterial lying exposed in the first region. The second material isselected such that it can be selectively etched relative to thesubstrate surface in an anisotropic etching process. It thus lies withinthe scope of the invention to provide the substrate of quartz with anetch-resistant cover layer of, for example, Si₃ N₄, and to providestructures of quartz. It also lies within the scope of the invention toprovide the substrate of sapphire and to provide structures of at leastone of the substances SiO₂ and Si₃ N₄.

This embodiment has the advantage that an etch stop during anisotropicetching into the carrier for producing the second regions on thesubstrate is established.

In a development of the invention, there are second regions that areannularly surrounded by one of the first regions in immediate adjacentfashion. This embodiment has the advantage that it can be manufacturedin a self-aligned manufacturing method.

The object is also achieved by a manufacturing method for a phase maskfor projection photolithography with first regions and second regionshaving the property that light of the wavelength λ that has passedthrough the first regions and light of the wavelength λ that has passedthrough the second region is phase-shifted by 180°±60° relative to oneanother. This manufacturing method has the following steps:

a) a carrier of light-transmissive material is provided with alight-absorbing layer and with a photoresist layer;

b) after structuring the photoresist layer with conventional masklithography, the first regions are produced by isotropic etching of thelight-absorbing layer down to the surface of the carrier;

c) the second regions are produced by anisotropic etching of the carrierto a depth d=λ(1±1/3)/2 (n₂ -n₁)), whereby n₂ is the refractive index inthe first regions and n₁ is the refractive index of the surroundingmedium.

It lies within the framework of the invention to produce the firstregions such that the light-absorbing layer is etched back under thestructured photoresist layer during the isotropic etching. A region ofthe carrier, wherein the carrier surface is uncovered under thephotoresist structures, thus arises. The expanse of the photoresiststructure is transferred onto the second regions in the manufacture ofthe second regions on the basis of anisotropic etching. The self-alignedannular arrangement of first regions around second regions can beachieved in this way.

The suppression of diffraction effects in the finished phase mask in anexposure means having the imaging scale m and the numerical aperture NAis especially effective when the expanse of the underetching under thestructured photoresist layer amounts to a =(c/m)·λ/NA per edge, wherebyc ∓0.12±0.08 applies.

The invention shall be set forth in greater detail below with referenceto exemplary embodiments and with reference to the figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a portion of a phase mask having a carrier that is composedof one and the same material throughout and that defines a second regionthat is annularly surrounded by a first region;

FIGS. 2 through 4 show a manufacturing method for this mask;

FIG. 5 shows a portion of a phase mask wherein the carrier is composedof a substrate and of an auxiliary layer arranged thereon, and thatdefines a first region that annularly surrounds a second region;

FIGS. 6 through 8 show manufacturing steps for this mask;

FIG. 9 shows a portion of a phase mask having a carrier that is composedof one and the same material throughout, and that defines first andsecond regions separated by light-absorbing material;

FIGS. 10 through 12 show manufacturing steps for this mask;

FIG. 13 shows a portion of a phase mask wherein the carrier is composedof a substrate and of an auxiliary layer arranged thereon, and whichdefines first and second regions separated by light-absorbing material;and

FIGS. 14 through 16 show manufacturing steps for this mask.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 shows a carrier 11. This carrier 11, for example, is composed ofquartz. A mask pattern 12 is arranged on the carrier 11. The maskpattern 12 is composed of light-absorbent material, for example ofchromium. A first region 13 and a second region 14 are present on thecarrier 11. The surface of the carrier 11 is uncovered both in the firstregion 13 as well as in the second region 14. The first region 13annularly surrounds the second region 14. The first region 13 and thesecond region 14 are thus immediately adjacent to one another. Theoptical thickness of the carrier 11 is d=λ(1±1/3)/(2 (n₂ -n₁)) smallerin the second region 14 than in the first region 13. λ is the wavelengthof the light employed in the exposure; n₂ is the refractive index of thecarrier; and n₁ is the refractive index of the surrounding medium. Inthe case of air, vacuum, or nitrogen as the surrounding medium, n₁ is 1.Light that traverses the phase mask in the first region 13 isphase-shifted by 180°±60° in comparison to light that traverses thephase mask in the second region 14.

A light-absorbing layer 12a is applied onto the carrier 11 formanufacturing the phase mask. The light-absorbing layer 12a, forexample, is composed of chromium and has a thickness of approximately100 nm. A photoresist layer is applied onto the light-absorbing layer12a and is structured with conventional optical lithography to formphotoresist structures 15. The photoresist structures 15 have an opening16. The opening 16 defines the lateral expanse of the second region 14(see FIG. 2).

The light-absorbing layer 12a is etched through the opening 16 in anisotropic etching process. For example, cerium ammonium nitrate issuitable as an etchant. The isotropic etching process is selectivevis-a-vis the surface of the carrier 11. The isotropic etching isoverdrawn so that undercuts 17 arise under the photoresist structures15. The surface of the first region 13 is uncovered due to the undercuts17 (see FIG. 3). The mask pattern 12 therefore arises from thelight-absorbing layer 12a.

An anisotropic etching process follows for generating the second region14 (see FIG. 4). The expanse of the opening 16 is thus transferred intothe carrier 11. For example, a plasma etching with a CHF₃ /O₂ gasmixture is suitable as the anisotropic etching process. The duration ofthe anisotropic etching process must be dimensioned such that thematerial of the carrier is eroded to a depth of d=λ(1±1/3)/(2 (n₂ -n₁)).The structure shown in FIG. 1 arises after the photoresist structures 15are removed.

FIG. 5 shows the portion of a phase mask that comprises a compositecarrier 21. The carrier 21 contains a substrate 211 and carrierstructures 212 arranged thereon. The substrate 211, for example, iscomposed of quartz having a thin cover layer of etch-resistant material100, for example Si₃ N₄ ; and the carrier structures 212 are composed ofquartz. The substrate 211, for example, can also be composed ofsapphire; the carrier structures 212 are then composed of SiO₂ and/orSi₃ N₄. A first region 23 in which the surface of the carrier structures212 lies exposed is provided. The first region 23 annularly surrounds asecond region 24 in which the surface of the substrate 211 lies exposed.The carrier structures 212 have a thickness of d=λ(1±1/3)/2 (n₂ -n₁)).Here, n₂ is the refractive index of the material of the structures 212.The other parameters have the same significance as in the firstexemplary embodiment.

For manufacturing a phase mask, a portion of which is shown in FIG. 5,an auxiliary layer 212a is applied onto the substrate 211 (see FIG. 6).The auxiliary layer 212a is composed of the same material as thestructures 212 that can be selectively etched vis-a-vis the surface ofthe substrate 211. A light-absorbing layer 22a is applied onto theauxiliary layer 212a. Photoresist structures 25 having an opening 26 areproduced on the light-absorbing layer 22a with conventional opticallithography.

The light-absorbing layer 22a is etched back with an isotropic etchingprocess. The isotropic etching process etches the light-absorbingmaterial selectively vis-a-vis the auxiliary layer 212a lyingtherebelow. For example, the following etching process is suitable:immersion into cerium ammonium nitrate.

In this step, the mask pattern 22 (see FIG. 7) arises from thelight-absorbing layer 22a. An undercutting 27, in the region of whichthe surface of the first region 23 lies exposed, arises.

The pattern of the photoresist structures 25 is transferred into theauxiliary layer 212a with an anisotropic etching process. The structures212 thus arise. The material of the auxiliary layer 212a is selectedsuch that the anisotropic etching occurs with good selectivity vis-a-visthe substrate 211 lying therebelow. In this case, an overdrawing of theetching is possible, as a result whereof vertical side walls of thestructures 212, and a right angle between the side walls of thestructures 212 and the substrate 211, can be achieved. In theanisotropic etching process, the surface of the substrate 211 isuncovered in the region of the second region 24 (see FIG. 8). A CHF₃ /O₂plasma having a small O₂ part is particularly suitable for theanisotropic etching process.

The structure shown in FIG. 5 results after the removal of thephotoresist structures 25.

It was found with the assistance of simulation calculations that wereimplemented with the program Sample 1.7 of Berkeley University, that theaffect of the phase mask is particularly good with reference to thesuppression of diffraction effects when the underetching 17, 27 has anexpanse parallel to the surface of the carrier of a=(c/m)·λ/NA, where mrepresents the imaging scale, NA represents the numerical aperture of anexposure means in which the phase mask is utilized, and c is a constantwhose value lies between 0.04 and 0.20 for the optimum effect of thediffraction suppression. The simulation calculations were carried outfor insulated lines, insulated columns, and lattices having a structuralsize w, this corresponding to k₁ =w·NA/λ=0.63.

FIG. 9 shows a portion of a phase mask having a carrier 31 and a maskpattern 32 arranged thereon. The carrier 31 comprises a first region 33and a second region 34. The optical thickness of the carrier isd=λ(1±1/3)/(2 (n₂ -n₁)) greater in the first region 33 than in thesecond region 34 (parameters as in FIG. 1). The carrier 31 is composedof quartz throughout. The mask pattern 32 is composed of alight-absorbent material, for example chromium. The first region 33 andthe second region 34 are separated from one another by a part of themask pattern 32.

For manufacturing a phase mask whereof a portion is shown in FIG. 9, themask pattern 32 is produced on the carrier 31 with a conventionaloptical phototechnique. The mask pattern 32 arises from alight-absorbing layer on the basis of an isotropic etching, for examplewith cerium ammonium nitrate (see FIG. 10). The mask pattern 32 leavesthe surface of the carrier 31 uncovered where the first region 33 andthe second region 34 are provided.

Photoresist structures 35 are produced on the carrier 31 with the maskpattern 32 on the basis of conventional phototechnique. The photoresiststructures 35 cover the first region 33, whereas they leave the carriersurface exposed in the region wherein the second region 34 is intendedto arise (see FIG. 11).

The second region 34 is produced with an anisotropic etching into thecarrier 31 (see FIG. 12). In the anisotropic etching, the neighboringparts of the mask pattern 32 act as an etching mask. The second region33 is protected by the photoresist structure 35. The etching into thecarrier 31 is implemented for such a time period that the material ofthe carrier 31 is etched off down to a depth of d=λ(1±1/3)/(2 (n₂ -n₁)).For example, CHF₃ /O₂ plasma etching is particularly suitable for theanisotropic etching process.

The structures shown in FIG. 9 result after the removal of thephotoresist structures 35.

FIG. 13 shows a portion of a phase mask that comprises a carrier 41. Thecarrier 41 is formed of a substrate 411, and of structures 412 arrangedthereon. For example, the substrate is composed of quartz having a thin,etch-resistant layer of, for example, Si₃ N₄ and the structures 412 arecomposed of quartz. In another example, the substrate 411 is composed ofsapphire and the structures are composed of SiO₂ and/or Si₃ N₄. A maskpattern 42 is arranged on the structures 412. The mask pattern 42 iscomposed of light-absorbent material, for example of chromium. Thecarrier 41 comprises a first region 43 in which the surface of thestructure 412 lies exposed. The carrier comprises a second region 44wherein the surface of the substrate 411 lies exposed. Since thestructures 412 have a thickness of d=λ(1±1/3)/(2 (n₂ -n₁)) (parametersas in FIG. 5), the optical thickness in the first region differs fromthe optical thickness in the second region of the carrier 41 such thatlight passing through the first region 43 and light passing through thesecond region 44 have a phase difference of 180°±60°.

For manufacturing the phase mask whereof a portion is shown in FIG. 13,an auxiliary layer 412a of the material of the structures 412 is appliedonto the substrate 411, this material being selectively etchablevis-a-vis the surface of the substrate 411. The mask pattern 42 isproduced with a conventional optical phototechnique and with isotropicetching. The surface of the auxiliary layer 412a is uncovered in theregion of the first region 43 and of the second region 44 (see FIG. 14).

Photoresist structures 45 are produced from the auxiliary layer 412a andfrom the mask pattern 42 arranged thereon. They are produced with theassistance of a lithography process. The photoresist structures 45 coverthe surface of the auxiliary layer 412a in the region of the firstregion 43. The surface of the auxiliary layer 412a is uncovered in thesecond region 44 (see FIG. 15).

The material of the auxiliary layer 412a is selected such that theauxiliary layer 412a is selectively etchable vis-a-vis the surface ofthe substrate 411 in an anisotropic etching process. The structures 412are produced with the assistance of such an anisotropic etching process(see FIG. 16). The second region 44 arises by etching off the auxiliarylayer 412a in this region. The neighboring mask patterns 42 thus act asan etching mask. Since the auxiliary 412a is etchable with goodselectivity vis-a-vis the surface of the substrate 411, the differencein the optical thickness in the first region 43 and in the second region44 can be very exactly set on the basis of the layer thickness of theauxiliary layer 412a.

The structure shown in FIG. 13 results after the removal of thephotoresist structures 45.

In the four described exemplary embodiments, the manufacture of thephase masks utilizes only standard process steps that are usual insemiconductor technology or mask techniques. Commercially obtained maskcarriers are employed in the first and in the third exemplaryembodiment. Only the anisotropic mask etching arises as an additionalprocess step in all four exemplary embodiments.

Phase masks having first and second regions that are arranged inself-aligned fashion relative to the mask pattern have been set forthwith reference to FIGS. 1 through 8. There the first regions annularlysurround the second regions. There is thus the advantage that noseparating, light-absorbing regions on the mask are required at theindividual structures. The applicability is thus considerablysimplified. Phase masks conforming to the third and fourth exemplaryembodiments that were set forth with reference to FIGS. 9 through 16have a higher potential for improving resolution and process latitude.

Although various minor changes and modifications might be proposed bythose skilled in the art, it will be understood that we wish to includewithin the claims of the patent warranted hereon all such changes andmodifications as reasonably come within our contribution to the art.

We claim as our invention:
 1. A method for manufacturing a phase maskfor projection photolithography having at least a first region and asecond region wherein light of wavelength λ which has passed through thefirst and second regions are phase-shifted by 180°±60° relative to oneanother, comprising the steps of:providing a carrier oflight-transmissive material with a light-absorbing layer and with aphotoresist layer; structuring the photoresist layer by masklithography, and then producing the first region by isotropic etching ofthe light-absorbing layer down onto a surface of the carrier, anunder-etching beneath the structured photoresist layer being produced inthe isotropic etching of the light-absorbing layer; and producing thesecond region by anisotropic etching of the carrier to a depthd=λ(1±1/3)/(2(n₂ -n₁), where n₂ is a refractive index in the firstregion and n₁ is a refractive index of a surrounding medium, theanisotropic etching occurring in edge alignment with the structuredphotoresist layer.
 2. A method according to claim 1 wherein theunder-etching beneath the structured photoresist layer is produced withan expanse of a=(c/m)·λ/NA under edges of the structured photoresistlayer, where m represents imaging scale and NA represents a numericalaperture of an exposure means in which the phase mask is employed, and cis a constant that assumes values in a range 0.04≦c≦0.20.
 3. A methodaccording to claim 1 wherein the carrier comprises an auxiliary layerformed of a second material which is applied onto a substrate formed ofa first material, said second material being selectively etchable withrespect to a surface of the substrate in an anisotropic etching process.4. A method according to claim 3 wherein the substrate is formed ofquartz having a thin, etch-resistant cover layer, and the auxiliarylayer is formed of quartz.
 5. A method according to claim 3 wherein thesubstrate is formed of sapphire, and the auxiliary layer is formed ofone of the substances selected from the group consisting of SiO₂ and Si₃N₄.
 6. A method for manufacturing a phase mask for projectionphotolithography having at least a first region and a second regionwherein light of wavelength λ which has passed through the first andsecond regions are phase-shifted by 180°±60° relative to one another,comprising the steps of:providing a carrier of light-transmissivematerial with a light-absorbing layer and with a photoresist layer;structuring the photoresist layer by mask lithography, and thenproducing a first opening and the first region by isotropic etching ofthe light-absorbing layer down onto a surface of the carrier; coveringthe first region with a further, structured photoresist layer; producingthe second region by anisotropic etching of the carrier through saidfirst opening to a depth d=λ(1±1/3)/(2(n₂ -n₁)), where n₂ is arefractive index in the first region and n₁ is a refractive index of asurrounding medium; and removing the further photoresist layer at saidfirst region.
 7. A method according to claim 6 wherein the carriercomprises an auxiliary layer formed of a second material which isapplied onto a substrate formed of a first material, said secondmaterial being selectively etchable with respect to a surface of thesubstrate in an anisotropic etching process.
 8. A method according toclaim 6 wherein the substrate is formed of quartz having a thin,etch-resistant cover layer, and the auxiliary layer is formed of quartz.9. A method according to claim 6 wherein the substrate is formed ofsapphire, and the auxiliary layer is formed of one of the substancesselected from the group consisting of SiO₂ and Si₃ N₄.
 10. A method formanufacturing a phase mask for projection photolithography having atleast a first region and a second region wherein light of wavelength λwhich has passed through the first and second regions are phase-shiftedby approximately 180° relative to one another, comprising the stepsof:providing a carrier of light-transmissive material with a non-lighttransmissive layer and with a photoresist layer; structuring thephotoresist layer, and then producing the first region by etching of thelight-absorbing layer down onto a surface of the carrier, anunder-etching beneath the structured photoresist layer being produced inthe isotropic etching of the light-absorbing layer; and producing thesecond region by etching of the carrier to a depth d=λ(1±1/3)/(2(n₂-n₁)), where n₂ is a refractive index in the first region and n₁ is arefractive index of a surrounding medium, the etching occurring in edgealignment with the structured photoresist layer.
 11. A method formanufacturing a phase mask for projection photolithography having atleast a first region and a second region wherein light of wavelength λwhich has passed through the first and second regions are phase-shiftedby approximately 180° relative to one another, comprising the stepsof:providing a carrier of light-transmissive material with a non-lighttransmissive layer and with a photoresist layer; structuring thephotoresist layer, and then producing a first opening and the firstregion by etching of the light-absorbing layer down onto a surface ofthe carrier; covering the first region with a further, structuredphotoresist layer; producing the second region by etching of the carrierthrough said first opening to a depth d=λ(1±1/3)/(2(n₂ -n₁)), where n₂is a refractive index in the first region and n₁ is a refractive indexof a surrounding medium; and removing the further photoresist layer atsaid first region.